LT5520EUF Linear Technology, LT5520EUF Datasheet - Page 11

IC MIXER UPCONV 1.3-2.3GHZ 16QFN

LT5520EUF

Manufacturer Part Number
LT5520EUF
Description
IC MIXER UPCONV 1.3-2.3GHZ 16QFN
Manufacturer
Linear Technology
Series
LT5520r
Datasheet

Specifications of LT5520EUF

Rf Type
General Purpose
Frequency
1.3GHz ~ 2.3GHz
Number Of Mixers
1
Gain
-1dB
Noise Figure
15dB
Secondary Attributes
Up Converter
Current - Supply
70mA
Voltage - Supply
4.5 V ~ 5.25 V
Package / Case
16-WQFN Exposed Pad
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT5520EUF
Manufacturer:
LT
Quantity:
10 000
Part Number:
LT5520EUF#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT5520EUF#TR
Manufacturer:
LINEAR-PB FREE
Quantity:
3 756
Part Number:
LT5520EUF#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE DESCRIPTIO
4.35 0.05
2.90 0.05
2.15 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.65 BCS
0.30 0.05
U
0.72 0.05
PACKAGE
OUTLINE
16-Lead Plastic QFN (4mm 4mm)
(Reference LTC DWG # 05-08-1692)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PIN 1
TOP MARK
UF Package
4.00 0.10
(4 SIDES)
0.75 0.05
0.200 REF
0.00 – 0.05
2.15 0.10
(4-SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
LT5520
16
0.65 BSC
0.30 0.05
0.55 0.20
11
1
2
(UF) QFN 0802
5520f

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