EVAL_PAN1315 Panasonic - ECG, EVAL_PAN1315 Datasheet - Page 2

• Manufacturer Part Number: EVAL_PAN1315
• Description: EVAL KIT FOR PAN1315 W/TI MSP430
• Manufacturer: Panasonic - ECG
• Type: Transceiver, Bluetooth 2.1+EDRr

Specifications of EVAL_PAN1315

• Featured Product: PAN1315 Bluetooth® HCI Module
• Frequency: 2.4GHz
• For Use With/related Products: PAN1315, MSP430
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: EVAL-PAN1315; P14265

CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1315
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
Scope of this Document ..................................................................................................4
Key Features...................................................................................................................4
Applications for the Module.............................................................................................5
Description for the Module ..............................................................................................5
Detailed Description ........................................................................................................6
5.1. PAN1315 Terminal Layout.....................................................................................6
5.2. Pin Description.......................................................................................................7
5.3. Device Power Supply.............................................................................................8
5.4. Clock Inputs ...........................................................................................................9
Bluetooth Features........................................................................................................10
Block Diagram...............................................................................................................11
Test Conditions .............................................................................................................11
General Device Requirements and Operation ..............................................................11
9.1. Absolute Maximum Ratings ................................................................................. 12
9.2. Recommended Operating Conditions..................................................................12
9.3. Current Consumption...........................................................................................13
9.4. General Electrical Characteristics........................................................................ 13
9.5. nSHUTD Requirements .......................................................................................14
9.6. External Digital Slow Clock Requirements (–20°C to +70°C) .............................. 14
Bluetooth RF Performance (BT)....................................................................................15
10.1. Bluetooth Receiver Characteristics – In-Band Signals ........................................15
10.2. Bluetooth Receiver Characteristics – General Blocking ...................................... 16
10.3. Bluetooth Receiver Characteristics – GFSK/EDR2/EDR3................................... 16
10.4. Bluetooth Transmitter, GFSK, Full output............................................................16
10.5. Bluetooth Transmitter, EDR, Full output ..............................................................17
10.6. Bluetooth Modulation, GFSK, Full output ............................................................17
10.7. Bluetooth Modulation, EDR, Full output............................................................... 18
10.8. Bluetooth Transmitter, Out-of-Band Emissions ...................................................18
Soldering Temperature-Time Profile (for reflow soldering) ........................................... 19
11.1. For lead solder.....................................................................................................19
11.2. For leadfree solder...............................................................................................19
Module Dimension ........................................................................................................20
FootPrint of the Module.................................................................................................20
Labelling Drawing..........................................................................................................21
14.1. Engineering Samples...........................................................................................21
14.2. Mass Production ..................................................................................................21
Mechanical Requirements.............................................................................................21
Recommended Foot Pattern .........................................................................................22
Development of Applications.........................................................................................23
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PRODUCT SPECIFICATION
PANASONIC’S CODE
ENW89818C2JF
Produktspezifikation
No.
DS-1315-2400-102
PAGE
Seite
DATE
Datum
www.pedeu.pansonic.de
21.04.2009
2 of 32
REV.
0.98