MW7IC18100NR1 Freescale Semiconductor, MW7IC18100NR1 Datasheet - Page 31

• Manufacturer Part Number: MW7IC18100NR1
• Description: IC PWR AMP RF LDMOS TO270-14
• Manufacturer: Freescale Semiconductor

Specifications of MW7IC18100NR1

• Current - Supply: 1.18A
• Frequency: 1.805GHz ~ 2.05GHz
• Gain: 30dB
• P1db: 51.93dBm
• Package / Case: TO-270-14
• Rf Type: GSM, EDGE
• Test Frequency: 1.9GHz
• Voltage - Supply: 24 ~ 32V
• Manufacturer's Type: Power Amplifier
• Number Of Channels: 1
• Frequency (max): 2.05GHz
• Operating Supply Voltage (min): 24V
• Operating Supply Voltage (typ): 28V
• Operating Supply Voltage (max): 32V
• Package Type: TO-270 WB EP
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Lead Free Status / Rohs Status: Compliant

RF Device Data
Freescale Semiconductor
Application Notes
• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
• AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over - Molded Plastic Packages
• AN3789: Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
Revision
Refer to the following documents to aid your design process.
The following table summarizes revisions to this document.
0
1
2
3
June 2007
May 2007
Mar. 2009
Apr. 2008
Date
• Initial Release of Data Sheet
• Removed Case Operating Temperature from Maximum Ratings table, p. 2. Case Operating Temperature
• Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related
• Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 2
• Updated PCB information to show more specific material details, Figs. 3, 27, Test Circuit Schematic, p. 4,
• Updated Part Numbers in Tables 6, 8, Component Designations and Values, to RoHS compliant part
• Replaced Case Outline 1617 - 01 with 1617 - 02, Issue A, p. 22 - 24. Revised cross - hatched area for
• Replaced Case Outline 1618 - 01 with 1618 - 02, Issue A, p. 25 - 27. Added pin numbers 1, 12, 13, and 14
• Replaced Case Outline 1621 - 01 with 1621 - 02, Issue A, p. 28 - 30. Added pin numbers 1, 12, 13, and 14
• Changed Storage Temperature Range in Max Ratings table from - 65 to +200 to - 65 to +150 for
• Updated Human Body Model ESD from Class 0 to 1 to reflect 2008 Human Body Model actual test data,
• Added footnote, Measurement made with device in straight lead configuration before any lead forming
rating will be added to the Maximum Ratings table when parts’ Operating Junction Temperature is
increased to 225°C.
“Continuous use at maximum temperature will affect MTTF” footnote added and changed 200°C to 225°C
in Capable Plastic Package bullet, p. 1, 2
14
numbers, p. 4, 14
exposed heat spreader. Added pin numbers 1, 12, 13, and 14 to Sheets 1 and 2. Corrected mm Min and
Max values for dimension A1 to 0.99 and 1.09, respectively.
and Pin 1 Index designation to Sheet 1. Corrected dimensions e and e1 on Sheet 1. Removed Pin 5
designation from Sheet 2.
and Pin 1 Index designation to Sheet 1. Corrected dimensions e and e1 on Sheets 1 and 3. Removed Pin 5
designation from Sheet 2.
standardization across products, p. 2.
p. 2
operation is applied, to Functional Tests table, p. 2.
PRODUCT DOCUMENTATION
REVISION HISTORY
MW7IC18100NR1 MW7IC18100GNR1 MW7IC18100NBR1
Description
31