WS2512-BLK Avago Technologies US Inc., WS2512-BLK Datasheet - Page 19

• Manufacturer Part Number: WS2512-BLK
• Description: MODULE PA UMTS2100 4X4MM 10-PIN
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS2512-BLK

• Package / Case: 10-DFN
• Current - Supply: 465mA ~ 510mA
• Frequency: 1.92GHz ~ 1.98GHz
• Gain: 23.5dB ~ 26.5dB
• Rf Type: W-CDMA, HSPDA
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 1980 MHz
• Operating Supply Voltage: 4.2 V
• Supply Current: 510 mA
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 1 Channel
• Frequency (max): 1.98GHz
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3.2V
• Single Supply Voltage (typ): 3.4V
• Single Supply Voltage (max): 4.2V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 90C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

Storage Condition
Packages described in this document must be stored in
sealed moisture barrier, antistatic bags. Shelf life in a
sealed moisture barrier bag is 12 months at <40 C and
90% relative humidity (RH) J-STD-033 p. 7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the PCB
within 168 hours as listed in the J-STD-020B p. 11 with
factory conditions <30 C and 60% RH.
Baking
It is not necessary to rebake the part if both conditions
(storage conditions and out-of bag conditions) have been
satisfied. Baking must be done if at least one of the
conditions above have not been satisfied. The baking
conditions are 125 C for 12 hours J-STD-033 p. 8.
CAUTION
Tape and reel materials typically cannot be baked at the
temperature described above. If out-of-bag exposure
time is exceeded, parts must be baked for a longer time
at low temperatures, or the parts must be dereeled,
detaped, rebaked and then put back on tape and reel.
(See moisture sensitive warning label on each shipping
bag for information of baking).
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200 C. This method
will minimize moisture related component damage. If
any component temperature exceeds 200 C, the board
must be baked dry per 4-2 prior to rework and/or
component removal. Component temperatures shall be
measured at the top center of the package body. Any
SMD packages that have not exceeded their floor life
can be exposed to a maximum body temperature as high
as their specified maximum reflow temperature.
Removal for Failure Analysis
Not following the above requirements may cause mois-
ture/reflow damage that could hinder or completely pre-
vent the determination of the original failure mechanism.
19
Baking of Populated Boards
Some SMD packages and board materials are not able
to withstand long duration bakes at 125 C. Examples of
this are some FR-4 materials, which cannot withstand a
24 hr bake at 125 C. Batteries and electrolytic capacitors
are also temperature sensitive. With component and
board temperature restrictions in mind, choose a bake
temperature from Table 4-1 in J-STD 033; then determine
the appropriate bake duration based on the component
to be removed. For additional considerations see
IPC-7711 and IPC-7721.
Derating Due to Factory Environmental Conditions
Factory floor life exposures for SMD packages removed
from the dry bags will be a function of the ambient
environmental conditions. A safe, yet conservative,
handling approach is to expose the SMD packages only
up to the maximum time limits for each moisture sensi-
tivity level as shown in Table 9. This approach, however,
does not work if the factory humidity or temperature is
greater than the testing conditions of 30 C/60% RH.
A solution for addressing this problem is to derate the
exposure times based on the knowledge of moisture
diffusion in the component package materials ref.
JESD22-A120). Recommended equivalent total floor life
exposures can be estimated for a range of humidities and
temperatures based on the nominal plastic thickness for
each device.
Table 11 lists equivalent derated floor lives for humidities
ranging from 20-90% RH for three temperature, 20 C, 25 C,
and 30 C.
This table is applicable to SMDs molded with novolac,
biphenyl or multifunctional epoxy mold compounds. The
following assumptions were used in calculating Table 11:
1. Activation Energy for Diffusion = 0.35eV (smallest
2. For 60% RH, use Diffusivity = 0.121 exp (-0.35 eV/kT)
3. For >60% RH, use Diffusivity = 1.320 exp (-0.35 eV/kT)
known value).
mm2/s (this used smallest known Diffusivity @ 30 C).
mm2/s (this used largest known Diffusivity @ 30 C).