WS2512-BLK Avago Technologies US Inc., WS2512-BLK Datasheet - Page 14

• Manufacturer Part Number: WS2512-BLK
• Description: MODULE PA UMTS2100 4X4MM 10-PIN
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS2512-BLK

• Package / Case: 10-DFN
• Current - Supply: 465mA ~ 510mA
• Frequency: 1.92GHz ~ 1.98GHz
• Gain: 23.5dB ~ 26.5dB
• Rf Type: W-CDMA, HSPDA
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 1980 MHz
• Operating Supply Voltage: 4.2 V
• Supply Current: 510 mA
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 1 Channel
• Frequency (max): 1.98GHz
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3.2V
• Single Supply Voltage (typ): 3.4V
• Single Supply Voltage (max): 4.2V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 90C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

PCB Design Guidelines
The recommended WS2512-TR1G PCB land pattern is
shown in Figure 29 and Figure 30. The substrate is
coated with solder mask between the I/O and conductive
paddle to protect the gold pads from short circuit that is
caused by solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads.
The recommended stencil layout is shown in Figure 31.
Reducing the stencil opening can potentially generate
more voids. On the other hand, stencil openings larger
than 100% will lead to excessive solder paste smear or
bridging across the I/O pads or conductive paddle to
adjacent I/O pads. Considering the fact that solder
paste thickness will directly affect the quality of the
solder joint, a good choice is to use laser cut stencil
composed of 0.100 mm (4 mils) or 0.127 mm (5 mils)
thick stainless steel which is capable of producing the
required fine stencil outline.
Figure 29. Metallization
14
0.85
0.4
0.25
0.6
0.1
Ø 0.3 mm
on 0.6 mm
0.5
Figure 30. Solder mask opening
Figure 31. Solder paste stencil aperture
0.85
0.85
0.5
0.4
0.6
0.7
2.4
2.0
0.55
0.5
1.8
1.6