BGU7003,132 NXP Semiconductors, BGU7003,132 Datasheet - Page 17

• Manufacturer Part Number: BGU7003,132
• Description: IC WIDEBAND AMP LN MMIC 6-XSON
• Manufacturer: NXP Semiconductors
• Type: Low Noise Amplifierr

Specifications of BGU7003,132

• P1db: -20.1dBm
• Noise Figure: 0.8dB
• Package / Case: 6-XSON, SOT891
• Current - Supply: 3mA ~ 15mA
• Frequency: 40MHz ~ 6GHz
• Rf Type: WLAN, GPS, CDMA, PCS
• Test Frequency: 1.575GHz
• Voltage - Supply: 2.2 V ~ 2.85 V
• Bandwidth: 40 MHz to 6 GHz
• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 1575 MHz
• Operating Supply Voltage: 2.2 V to 2.85 V
• Supply Current: 3 mA to 15 mA
• Maximum Power Dissipation: 70 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-5112-1

NXP Semiconductors
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
14. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
BGU7003
Product data sheet
http://www.nxp.com
Rev. 02 — 22 June 2010
Wideband silicon germanium low-noise amplifier MMIC
[e-mail]
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BGU7003
© NXP B.V. 2010. All rights reserved.
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