BGU7003,132 NXP Semiconductors, BGU7003,132 Datasheet - Page 15

• Manufacturer Part Number: BGU7003,132
• Description: IC WIDEBAND AMP LN MMIC 6-XSON
• Manufacturer: NXP Semiconductors
• Type: Low Noise Amplifierr

Specifications of BGU7003,132

• P1db: -20.1dBm
• Noise Figure: 0.8dB
• Package / Case: 6-XSON, SOT891
• Current - Supply: 3mA ~ 15mA
• Frequency: 40MHz ~ 6GHz
• Rf Type: WLAN, GPS, CDMA, PCS
• Test Frequency: 1.575GHz
• Voltage - Supply: 2.2 V ~ 2.85 V
• Bandwidth: 40 MHz to 6 GHz
• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 1575 MHz
• Operating Supply Voltage: 2.2 V to 2.85 V
• Supply Current: 3 mA to 15 mA
• Maximum Power Dissipation: 70 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-5112-1

NXP Semiconductors
10. Soldering
11. Abbreviations
12. Revision history
Table 12.
BGU7003
Product data sheet
Document ID
BGU7003 v.2
Modifications:
BGU7003 v.1
Revision history
Table 11.
Acronym
AC
CDMA
DC
FR4
GPS
LNA
MMIC
RF
SiGe:C
SMA
WLAN
Fig 24. Reflow soldering footprint
Release date
20100622
20090302
•
Legal information updated.
Reflow soldering is the only recommended soldering method.
Abbreviations
1.4
Description
Alternating Current
Code Division Multiple Access
Direct Current
Flame Retardant 4
Global Positioning System
Low-Noise Amplifier
Monolithic Microwave Integrated Circuit
Radio Frequency
Silicon Germanium Carbon
SubMiniature version A
Wireless Local Area Network
0.7
Data sheet status
Product data sheet
Product data sheet
0.15
(6×)
Rev. 02 — 22 June 2010
0.25
(6×)
Wideband silicon germanium low-noise amplifier MMIC
1.05
0.35
(6×)
0.5
Change notice
-
-
(6×)
0.6
Dimensions in mm
solder resist
solder land plus
solder paste
occupied area
Supersedes
BGU7003 v.1
-
sot891_fr
BGU7003
© NXP B.V. 2010. All rights reserved.
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