EVAL-ADM1066LFEBZ Analog Devices Inc, EVAL-ADM1066LFEBZ Datasheet - Page 8

BOARD EVALUATION FOR ADM1066LF

EVAL-ADM1066LFEBZ

Manufacturer Part Number
EVAL-ADM1066LFEBZ
Description
BOARD EVALUATION FOR ADM1066LF
Manufacturer
Analog Devices Inc

Specifications of EVAL-ADM1066LFEBZ

Main Purpose
Power Management, Power Supply Supervisor/Tracker/Sequencer
Embedded
No
Utilized Ic / Part
ADM1066
Primary Attributes
10 Channel Supervisor / Sequencer, 6 Voltage Output DACs
Secondary Attributes
GUI Programmable via SMBus (via USB)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADM1066
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Voltage on VH Pin
Voltage on VPx Pins
Voltage on VXx Pins
Voltage on AUX1, AUX2 Pins
Voltage on A0, A1 Pins
Voltage on REFIN, REFOUT Pins
Voltage on VDDCAP, VCCP Pins
Voltage on DACx Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
Storage Temperature Range
Lead Temperature,
ESD Rating, All Pins
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Soldering Vapor Phase, 60 sec
J
max)
Rating
16 V
7 V
−0.3 V to +6.5 V
−0.3 V to +5 V
−0.3 V to +7 V
5 V
6.5 V
6.5 V
16 V
7 V
−0.3 V to +0.3 V
±5 mA
±20 mA
150°C
−65°C to +150°C
215°C
2000 V
Rev. D | Page 8 of 32
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
40-Lead LFCSP
48-Lead TQFP
ESD CAUTION
θ
JA
is specified for the worst-case conditions, that is, a device
θ
25
50
JA
Unit
°C/W
°C/W

Related parts for EVAL-ADM1066LFEBZ