MCF5274CVM166 Freescale Semiconductor, MCF5274CVM166 Datasheet - Page 20

• Manufacturer Part Number: MCF5274CVM166
• Description: IC MPU 32BIT 166MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5274CVM166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Operating Temperature Range: -40°C To +85°C
• Processor Type: 68K/ColdFire V2
• Rohs Compliant: Yes
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Electrical Characteristics
8.3
20
For most applications P
neglected) is:
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
equilibrium) for a known T
and (2) iteratively for any value of T
ESD Protection
1
2
Characteristics
ESD Target for Human Body Model
ESD Target for Machine Model
HBM Circuit Description
MM Circuit Description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of Pulses
P
P
INT
I/O
positive pulses
negative pulses
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive
Grade Integrated Circuits.
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the
device specification requirements. Complete DC parametric and functional testing is
performed per applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
positive pulses
negative pulses
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
= I
= Power Dissipation on Input and Output Pins — User Determined
I/O
DD
K = P
A
< P
. Using this value of K, the values of P
× V
INT
D
DD
Table 9. ESD Protection Characteristics
× (T
, Watts - Chip Internal Power
and can be ignored. An approximate relationship between P
A
A
.
+ 273 °C) + Θ
P
D
=
K
÷
(
T
J
JMA
+
273°C
× P
D
)
2
D
(2)
(3)
and T
Symbol
R
R
HBM
MM
series
series
—
—
—
—
—
C
C
J
can be obtained by solving equations (1)
1, 2
Value
2000
1500
200
100
200
0
1
1
3
3
1
D
Freescale Semiconductor
and T
Units
sec
pF
pF
—
—
V
V
Ω
Ω
J
(if P
I/O
D
is
(at