MCF5274CVM166 Freescale Semiconductor, MCF5274CVM166 Datasheet - Page 15

• Manufacturer Part Number: MCF5274CVM166
• Description: IC MPU 32BIT 166MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5274CVM166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Operating Temperature Range: -40°C To +85°C
• Processor Type: 68K/ColdFire V2
• Rohs Compliant: Yes
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

6.2
Figure 6
Freescale Semiconductor
15X
e
Y
E
shows MCF5275 256 MAPBGA package dimensions.
Package Dimensions - 256 MAPBGA
S
X
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
12
11
VIEW M-M
10
D
7
6
5
15X
S
4
3
Figure 4. 256 MAPBGA Package Dimensions
e
2
1
M
G
H
K
A
B
C
D
E
F
L
N
P
R
T
J
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
3
M
M
Z
Z
X
Y
A
A2
A1
Z
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM
A1
A2
A
D
b
E
e
S
°
MILLIMETERS
MIN
1.25
0.27
0.40
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
MAX
1.60
0.47
0.60
Z
Mechanicals/Pinouts
0.30
5
Z
15