HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 502
HD64F2319VTE25
Manufacturer Part Number
HD64F2319VTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2319VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2319VTE25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 12 Serial Communication Interface (SCI)
Figure 12.6 shows an example of the operation for transmission in asynchronous mode.
Rev.7.00 Feb. 14, 2007 page 468 of 1108
REJ09B0089-0700
TDRE
TEND
TXI interrupt
request generated
1
Start
bit
Figure 12.6 Example of Transmit Operation in Asynchronous Mode
0
Data written to TDR and
TDRE flag cleared to 0 in
TXI interrupt handling routine
D0
(Example with 8-Bit Data, Parity, One Stop Bit)
D1
1 frame
Data
D7
Parity
bit
0/1
TXI interrupt
request generated
Stop
bit
1
Start
bit
0
D0
D1
Data
D7
Parity
bit
0/1
TEI interrupt
request generated
Stop
bit
1
Idle state
(mark state)
1
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