HD64F2319VTE25 Renesas Electronics America, HD64F2319VTE25 Datasheet - Page 188
HD64F2319VTE25
Manufacturer Part Number
HD64F2319VTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2319VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2319VTE25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 6 Bus Controller
Table 6.3
ABWCR
ABWn
0
1
6.3.3
The chip’s memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; and a burst ROM interface that allows direct connection of burst ROM.
The interface can be selected independently for each area.
An area for which the basic bus interface is designated functions as normal space, and an area for
which the burst ROM interface is designated functions as burst ROM space.
Rev.7.00 Feb. 14, 2007 page 154 of 1108
REJ09B0089-0700
Memory Interfaces
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
WCRH, WCRL
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Access States
2
3
2
3
Program Wait
States
0
0
1
2
3
0
0
1
2
3
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