MC56F8323VFB60 Freescale Semiconductor, MC56F8323VFB60 Datasheet - Page 129

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MC56F8323VFB60

Manufacturer Part Number
MC56F8323VFB60
Description
IC MPU HYBRID DSP 32K 64-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet

Specifications of MC56F8323VFB60

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
27
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LQFP
For Use With
MC56F8323EVME - BOARD EVALUATION MC56F8323
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

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Quantity
Price
Part Number:
MC56F8323VFB60
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Quantity:
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10.16 Equivalent Circuit for ADC Inputs
Figure 10-22
at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and
hold circuit moves to (V
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about (V
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, V
10.17 Power Consumption
See
can be used to optimize power consumption for a given application.
Power consumption is given by the following equation:
A, the internal [static component], is comprised of the DC bias currents for the oscillator, current, PLL,
and voltage references. These sources operate independently of processor state or operating frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
Freescale Semiconductor
Preliminary
Total power =
1.
2.
3.
4.
Part 10
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
REF
for a list of IDD requirements for the 56F8323. This section provides additional detail which
illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
Analog Input
and the ADC clock frequency.
+D: external [dynamic component]
+B: internal [state-dependent component]
+C: internal [dynamic component]
+E: external [static]
A: internal [static component]
1
Figure 10-22 Equivalent Circuit for A/D Loading
REFH
-V
REFLO
2
56F8323 Technical Data, Rev. 17
)/2, while the other charges to the analog input voltage. When the
(V
REFH
3
- V
REFLO
)/2
S1
S2
4
S3
REFH
C1
C2
S/H
-V
REFLO
C1 = C2 = 1pF
Equivalent Circuit for ADC Inputs
)/2. The switches switch
129

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