MC9S08GB60CFU Freescale Semiconductor, MC9S08GB60CFU Datasheet - Page 282
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S08GB60CFU
Manufacturer Part Number
MC9S08GB60CFU
Description
IC MCU 60K FLASH 20MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.M68EVB908GB60E.pdf
(290 pages)
Specifications of MC9S08GB60CFU
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08GB60CFU
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08GB60CFU
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Company:
Part Number:
MC9S08GB60CFUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08GB60CFUE
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MC9S08GB60CFUER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Appendix B Ordering Information and Mechanical Drawings
B.3
282
C L
VIEW Y
H
C
3X
SEATING
PLANE
AB
AB
A
A
64-Pin LQFP Package Drawing
16
1
4X
VIEW Y
64
17
0.2 H A-B D
D/2
D1/2
X=A, B OR D
X
D1
D
60X
e/2
e
4X
4X
D
( 2)
q ( 3)
q
49
32
MC9S08GB/GT Data Sheet, Rev. 2.3
PLATING
48
33
4X 16 TIPS
B
E1/2
0.2 C A-B D
c
VIEW AA
CASE 840F-02
ROTATED 90 CLOCKWISE
SECTION AB-AB
E/2
ISSUE B
0.08
0.08 C
E1
BASE METAL
M
b1
b
°
E
C
A-B
D
c1
N
1. DIMENSIONS AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE DATUM H IS LOCATED AT BOTTOM
4. DATUMS A, B AND D TO BE DETERMINED AT DATUM
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
7. DIMENSION b DOES NOT INCLUDE DAMBAR
A1
OTES:
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
PLANE DATUM C.
SEATING PLANE DATUM C.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE.
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE b DIMENSION TO EXCEED 0.35.
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07.
A2
VIEW AA
0.05
(S)
(L2)
DIM
q
q
q
A1
A2
b1
c1
D1
E1
L1
L2
R1
A
b
D
E
L
S
q
c
e
1
2
3
S
MILLIMETERS
MIN
0.05
1.35
0.17
0.17
0.09
0.09
0.45
0.10
12.00 BSC
10.00 BSC
12.00 BSC
10.00 BSC
12
0.50 BSC
1.00 REF
0.50 REF
0.20 REF
0
0
12 REF
(L1)
---
°
°
°
°
L
REF
7
MAX
1.60
0.15
1.45
0.27
0.23
0.20
0.16
0.75
0.20
°
Freescale Semiconductor
---
q
q
1
DATE 09/16/98
GAGE PLANE
0.25
2X R
R1
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