MC9S08GB60CFU Freescale Semiconductor, MC9S08GB60CFU Datasheet - Page 110

no-image

MC9S08GB60CFU

Manufacturer Part Number
MC9S08GB60CFU
Description
IC MCU 60K FLASH 20MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GB60CFU

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08GB60CFU
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08GB60CFU
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
MC9S08GB60CFUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08GB60CFUE
Manufacturer:
FREESCALE
Quantity:
1 000
Part Number:
MC9S08GB60CFUE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC9S08GB60CFUER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Internal Clock Generator (ICG) Module
When the ICG is in either FEI or SCM mode, XCLK is turned off. Any peripherals which can use XCLK
as a clock source must not do so when the ICG is in FEI or SCM mode.
7.4
7.4.1
The section is intended to give some basic direction on which configuration a user would want to select
when initializing the ICG. For some applications, the serial communication link may dictate the accuracy
of the clock reference. For other applications, lowest power consumption may be the chief clock
consideration. Still others may have lowest cost as the primary goal. The ICG allows great flexibility in
choosing which is best for any application.
The following sections contain initialization examples for various configurations.
Important configuration information is repeated here for reference sake.
110
1. The IRG typically consumes 100 µA. The FLL and DCO typically consumes 0.5 to 2.5 mA, depending upon output frequency.
For minimum power consumption and minimum jitter, choose N and R to be as small as possible.
Bypassed
Engaged
FLL
FLL
Initialization/Application Information
Introduction
Hexadecimal values designated by a preceding $, binary values designated
by a preceding %, and decimal values have no preceding character.
FEI
4 MHz < f
Medium power (will be less than FEE if oscillator
range = high)
Good clock accuracy (After IRG is trimmed)
Lowest system cost (no external components
required)
IRG is on. DCO is on.
SCM
This mode is mainly provided for quick and reliable
system startup.
3 MHz < f
3 MHz < f
Medium power
Poor accuracy.
IRG is off. DCO is on and open loop.
Clock Reference Source = Internal
Bus
Bus
Bus
< 20 MHz.
< 5 MHz (default).
< 20 MHz (via filter bits).
Table 7-4. ICG Configuration Consideration
(1)
MC9S08GB/GT Data Sheet, Rev. 2.3
NOTE
FEE
4 MHz < f
Medium power (will be less than FEI if oscillator
range = low)
High clock accuracy
Medium/High system cost (crystal, resonator or
external clock source required)
IRG is off. DCO is on.
FBE
f
used.
Lowest power
Highest clock accuracy
Medium/High system cost (Crystal, resonator or
external clock source required)
IRG is off. DCO is off.
Bus
range <= 8 MHz when crystal or resonator is
Clock Reference Source = External
Bus
< 20 MHz
Freescale Semiconductor

Related parts for MC9S08GB60CFU