TS80C51RA2-VIA Atmel, TS80C51RA2-VIA Datasheet - Page 55

IC MCU 8BIT 256BYTE 40MHZ 40-DIP

TS80C51RA2-VIA

Manufacturer Part Number
TS80C51RA2-VIA
Description
IC MCU 8BIT 256BYTE 40MHZ 40-DIP
Manufacturer
Atmel
Series
80Cr
Datasheets

Specifications of TS80C51RA2-VIA

Core Processor
8051
Core Size
8-Bit
Speed
40/30MHz
Connectivity
UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
8.4. EPROM Erasure (Windowed Packages Only)
Erasing the EPROM erases the code array, the encryption array and the lock bits returning the parts to full
functionality.
Erasure leaves all the EPROM cells in a 1’s state (FF).
8.4.1. Erasure Characteristics
The recommended erasure procedure is exposure to ultraviolet light (at 2537 Å) to an integrated dose at least 15
W-sec/cm
of about 25 mm, should be sufficient. An exposure of 1 hour is recommended with most of standard erasers.
Erasure of the EPROM begins to occur when the chip is exposed to light with wavelength shorter than approximately
4,000 Å. Since sunlight and fluorescent lighting have wavelengths in this range, exposure to these light sources
over an extended time (about 1 week in sunlight, or 3 years in room-level fluorescent lighting) could cause
inadvertent erasure. If an application subjects the device to this type of exposure, it is suggested that an opaque
label be placed over the window.
Rev. C - 06 March, 2001
2
ALE/PROG
. Exposing the EPROM to an ultraviolet lamp of 12,000 W/cm
A0-A12
EA/VPP
Control sig-
nals
D0-D7
12.75V
5V
0V
Figure 19. Programming and Verification Signal’s Waveform
Programming Cycle
Data In
100 s
Read/Verify Cycle
Data Out
2
rating for 30 minutes, at a distance
TS83C51RB2/RC2/RD2
TS87C51RB2/RC2/RD2
TS80C51RA2/RD2
55

Related parts for TS80C51RA2-VIA