SAK-XC2365-72F66L AC Infineon Technologies, SAK-XC2365-72F66L AC Datasheet - Page 77

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SAK-XC2365-72F66L AC

Manufacturer Part Number
SAK-XC2365-72F66L AC
Description
IC MCU 32BIT FLASH 100-LQFP
Manufacturer
Infineon Technologies
Series
XC23xxr
Datasheet

Specifications of SAK-XC2365-72F66L AC

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
75
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
SP000313901
4.2.3
The power consumed by the XC2365 depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
To determine the actual power consumption, always both components, switching current
I
I
Note: The power consumption values are not subject to production test. They are
The given power consumption parameters and their values refer to specific operating
conditions:
Note: The maximum values cover the complete specified operating range of all
For additional information, please refer to
Data Sheet
S
DDP
(Table
The switching current
The leakage current
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
=
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for
maximum possible current, see parameter
I
S
+
16) and leakage current
I
Power Consumption
LK
.
I
LK
I
S
depends on the device temperature
depends on the device activity
I
LK
(Table
Section
75
17) must be added:
I
CC
5.2,
in
Thermal
XC2000 Family Derivatives
Table
V
DDI
20.
Electrical Parameters
Considerations.
are charged with the
V2.1, 2008-08
XC2365

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