SAK-XC2365-72F66L AC Infineon Technologies, SAK-XC2365-72F66L AC Datasheet - Page 30

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SAK-XC2365-72F66L AC

Manufacturer Part Number
SAK-XC2365-72F66L AC
Description
IC MCU 32BIT FLASH 100-LQFP
Manufacturer
Infineon Technologies
Series
XC23xxr
Datasheet

Specifications of SAK-XC2365-72F66L AC

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
75
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
SP000313901
Table 4
Pin
10
38,
64,
88
14
2,
25,
27,
50,
52,
75,
77,
100
1,
26,
51,
76
1) To generate the reference clock output for bus timing measurement,
2) Pin TRef was used to control the core voltage generation in step AA. For that step, pin TRef must be connected
Data Sheet
EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This
configuration is referred to as reference clock output signal CLKOUT.
to
This connection is no more required from step AB on. For the current step, pin TRef is logically not connected.
Future derivatives will feature an additional general purpose IO pin at this position.
V
DDPB
Symbol
V
V
V
V
V
DDIM
DDI1
DDPA
DDPB
SS
.
Pin Definitions and Functions (cont’d)
Ctrl.
-
-
-
-
-
Type Function
PS/M Digital Core Supply Voltage for Domain M
PS/1 Digital Core Supply Voltage for Domain 1
PS/A Digital Pad Supply Voltage for Domain A
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
Decouple with a ceramic capacitor, see
for details.
Decouple with a ceramic capacitor, see
for details.
All
Connect decoupling capacitors to adjacent
V
Note: The A/D_Converters and ports P5, P6, and
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected to
DDP
DDP
V
V
DDI1
SS
/
/
V
V
28
P15 are fed from supply voltage
except P5, P6, and P15 are fed from supply
voltage
The respective board area must be
connected to ground (if soldered) or left free.
SS
SS
pins must be connected to the ground-line
pins must be connected to each other.
pin pairs as close as possible to the pins.
pin pairs as close as possible to the pins.
V
DDPB
XC2000 Family Derivatives
.
General Device Information
f
SYS
must be selected as source for
V2.1, 2008-08
V
Table 12
Table 12
DDPA
XC2365
.
V
SS
.

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