SAK-XC2365-72F66L AC Infineon Technologies, SAK-XC2365-72F66L AC Datasheet - Page 109
SAK-XC2365-72F66L AC
Manufacturer Part Number
SAK-XC2365-72F66L AC
Description
IC MCU 32BIT FLASH 100-LQFP
Manufacturer
Infineon Technologies
Series
XC23xxr
Datasheet
1.SAK-XC2365-72F66L_AC.pdf
(112 pages)
Specifications of SAK-XC2365-72F66L AC
Core Processor
C166SV2
Core Size
16/32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
75
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
SP000313901
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5
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XC2365 into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 34
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Data Sheet
exposed pad not soldered.
soldered.
to the board.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-100-3)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
Min.
–
–
107
Limit Values
Max.
6.2 × 6.2
1.0
49
37
22
XC2000 Family Derivatives
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
–
V2.1, 2008-08
XC2365
3)
1)
2)
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