SAK-XC2364B-24F40L Infineon Technologies, SAK-XC2364B-24F40L Datasheet - Page 80

• Manufacturer Part Number: SAK-XC2364B-24F40L
• Description: IC MCU 16BIT FLASH 100-LQFP
• Manufacturer: Infineon Technologies
• Series: XC23xxBr

Specifications of SAK-XC2364B-24F40L

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• Ram Size: 18K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LSQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: SP000627180

Table 17
Parameter
Output High voltage
Output Low Voltage
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
8) As a rule, with decreasing output current the output levels approach the respective supply level (
Data Sheet
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
(
leakage current. An additional error current (
Please refer to the definition of the overload coupling factor
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV =
which applies for maximum temperature.
device:
pin level:
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
V
V
OH
IN
->
>
V
V
V
DDP
V
DDP
DDP
PIN
V
). However, only the levels for nominal output currents are verified.
PIN
), a certain amount of current may flow through the protection diodes. This current adds to the
-
<=
V
>=
DC Characteristics for Lower Voltage Range (cont’d)
PIN
V
IL
V
[V]):
IH
for a pullup;
for a pullup;
7)
7)
I
OZ
=
T
J
I
OZtempmax
= junction temperature [°C]):
V
Symbol
V
V
PIN
V
OH
OL
PIN
>=
CC
CC
<=
- (1.6 x DV) (μA]. This voltage derating formula is an approximation
V
IH
V
IL
for a pulldown.
I
INJ
for a pulldown.
Min.
V
1.0
V
0.4
−
−
XC2361B, XC2363B, XC2364B, XC2365B
DDP
DDP
) will flow if an overload current flows through an adjacent pin.
80
-
-
Values
Typ.
−
−
−
−
K
I
OZ
OV
= 0.05 x e
.
XC2000 Family / Value Line
Max.
−
−
0.4
1.0
(1.5 + 0.028 x TJ>)
Unit Note /
V
V
V
V
Electrical Parameters
V
IN
<
Test Condition
I
I
I
I
[μA]. For example, at
OH
OH
OL
OL
V
SS
≤
≤
≥
≥
) or supply ripple
V1.2, 2010-04
I
I
I
I
OLnom
OLmax
OHmax
OHnom
V
OL
8)
8)
->
V
SS
,