SAK-XC2364B-24F40L Infineon Technologies, SAK-XC2364B-24F40L Datasheet - Page 120

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SAK-XC2364B-24F40L

Manufacturer Part Number
SAK-XC2364B-24F40L
Description
IC MCU 16BIT FLASH 100-LQFP
Manufacturer
Infineon Technologies
Series
XC23xxBr

Specifications of SAK-XC2364B-24F40L

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
192KB (192K x 8)
Program Memory Type
FLASH
Ram Size
18K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LSQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
SP000627180

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAK-XC2364B-24F40L
Manufacturer:
Infineon Technologies
Quantity:
10 000
Table 39
Parameter
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
DAP1 hold after DAP0
rising edge
DAP1 valid per DAP0
clock period
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
Figure 27
Data Sheet
0.5
V
D D P
2)
DAP Interface Timing for Lower Voltage Range
Test Clock Timing (DAP0)
1)
1)
t
1 2
Symbol
t
t
t
t
t
t
t
t
t
11
12
13
14
15
16
17
19
1 1
SR
SR
SR
SR
SR
SR
SR
CC
t
1 3
Min.
25
8
8
6
6
12
XC2361B, XC2363B, XC2364B, XC2365B
120
Values
Typ.
17
t
1 5
XC2000 Family / Value Line
Max.
4
4
Unit Note /
ns
ns
ns
ns
ns
ns
ns
ns
Electrical Parameters
t
1 4
Test Condition
V1.2, 2010-04
MC_DAP0
0.9
0.1
V
V
D D P
D D P

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