SAK-XC2364B-24F40L Infineon Technologies, SAK-XC2364B-24F40L Datasheet - Page 37

• Manufacturer Part Number: SAK-XC2364B-24F40L
• Description: IC MCU 16BIT FLASH 100-LQFP
• Manufacturer: Infineon Technologies
• Series: XC23xxBr

Specifications of SAK-XC2364B-24F40L

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• Ram Size: 18K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LSQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: SP000627180

Table 6
Pin
2,
25,
27,
50,
52,
75,
77,
100
1,
26,
51,
76
1) To generate the reference clock output for bus timing measurement,
Data Sheet
EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This
configuration is referred to as reference clock output signal CLKOUT.
Symbol
V
V
DDPB
SS
Pin Definitions and Functions (cont’d)
Ctrl.
-
-
Type Function
PS/B Digital Pad Supply Voltage for Domain B
PS/-- Digital Ground
Connect decoupling capacitors to adjacent
V
Note: The on-chip voltage regulators and all ports
All
or ground-plane.
Note: Also the exposed pad is connected
DDP
XC2361B, XC2363B, XC2364B, XC2365B
V
SS
/
V
37
except P5, P6 and P15 are fed from supply
voltage
internally to
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
SS
pins must be connected to the ground-line
pin pairs as close as possible to the pins.
V
DDPB
XC2000 Family / Value Line
.
V
General Device Information
SS
f
SYS
. To improve the EMC
must be selected as source for
V1.2, 2010-04