SAK-XC2365B-40F80L AA Infineon Technologies, SAK-XC2365B-40F80L AA Datasheet - Page 127

• Manufacturer Part Number: SAK-XC2365B-40F80L AA
• Description: IC MCU 16BIT 320KB FLASH 100LQFP
• Manufacturer: Infineon Technologies
• Series: XC23xxBr

Specifications of SAK-XC2365B-40F80L AA

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 320KB (320K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LSQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

5.2
When operating the XC236xB in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(switching current and leakage current).
OH
+
) ×
P
IODYN
I
OH
) + Σ(
) ×
R
ΘJA
V
OL
×
XC2361B, XC2363B, XC2364B, XC2365B
I
OL
127
)
R
ΘJA
” quantifies these parameters. The
XC2000 Family / Value Line
Package and Reliability
P
IODYN
V1.2, 2010-04
) depends