SAK-XC2365B-40F80L AA Infineon Technologies, SAK-XC2365B-40F80L AA Datasheet - Page 120

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SAK-XC2365B-40F80L AA

Manufacturer Part Number
SAK-XC2365B-40F80L AA
Description
IC MCU 16BIT 320KB FLASH 100LQFP
Manufacturer
Infineon Technologies
Series
XC23xxBr
Datasheet

Specifications of SAK-XC2365B-40F80L AA

Core Processor
C166SV2
Core Size
16/32-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
320KB (320K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LSQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Table 39
Parameter
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
DAP1 hold after DAP0
rising edge
DAP1 valid per DAP0
clock period
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
Figure 27
Data Sheet
0.5
V
D D P
2)
DAP Interface Timing for Lower Voltage Range
Test Clock Timing (DAP0)
1)
1)
t
1 2
Symbol
t
t
t
t
t
t
t
t
t
11
12
13
14
15
16
17
19
1 1
SR
SR
SR
SR
SR
SR
SR
CC
t
1 3
Min.
25
8
8
6
6
12
XC2361B, XC2363B, XC2364B, XC2365B
120
Values
Typ.
17
t
1 5
XC2000 Family / Value Line
Max.
4
4
Unit Note /
ns
ns
ns
ns
ns
ns
ns
ns
Electrical Parameters
t
1 4
Test Condition
V1.2, 2010-04
MC_DAP0
0.9
0.1
V
V
D D P
D D P

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