HD64F2166VTE33 Renesas Electronics America, HD64F2166VTE33 Datasheet - Page 164
HD64F2166VTE33
Manufacturer Part Number
HD64F2166VTE33
Description
IC H8S MCU FLASH 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Specifications of HD64F2166VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 6.14 Bus Specifications for CP Extended Area/Multiplex Bus Interface (Data Cycle)
6.4.2
The external address space (H'FFF000 to H'FFF7FF) can be accessed by specifying the AS/IOS
pin as an I/O strobe pin. The 256-kbyte extended area (H'F80000 to H'FBFFFF) and CP extended
area (H'FFC000 to H'FFDFFF) can be accessed by the CS256 pin and CPCS1 pin functions,
respectively.
The external address space is initialized as the basic bus interface and a 3-state access space. In
mode 2, the address space other than on-chip ROM, on-chip RAM, internal I/O registers, and their
reserved areas is specified as the external address space. The on-chip RAM and its reserved area
are enabled when the RAME bit in SYSCR is set to 1, and disabled when the RAME bit is cleared
to 0. Addresses H'FF0800 to H'FFBFFF, H'FFE080 to H'FFEFFF, and H'FFFF00 to H'FFFF7F in
the on-chip RAM area and its reserved area are always specified as the external address space.
Rev. 3.00, 03/04, page 122 of 830
ASTCP
0
1
Advanced Mode
WMS21
—
0
Other than WMS21 = 0
and WMS20 = 1
WMS20
—
1
WC22
—
—
—
WC21
—
—
0
1
WC20
—
—
0
1
0
1
Number of
Access
States
2
3
3
Number of
Program
Wait
States
0
0
0
1
2
3
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