DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 549
DF3052BX25V
Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3052BX25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 549 of 847
- Download datasheet (6Mb)
TEND
ERS
Retransmission when SCI is in Transmit Mode (See Figure 14.12)
6. After transmitting one frame, if the receiving device returns an error signal, the SCI sets the
7. The TEND bit in SSR is not set for the frame in which the error signal was received,
8. If no error signal is returned from the receiving device, the ERS flag is not set in SSR.
9. If no error signal is returned from the receiving device, transmission of the frame, including
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
TDRE
Transfer from TDR to TSR
ERS flag to 1 in SSR. If the RIE bit in SCR is set to the enable state, an ERI interrupt is
requested. The ERS flag should be cleared to 0 in SSR before the next parity bit sampling
timing.
indicating an error.
retransmission, is assumed to be complete, and the TEND bit is set to 1 in SSR. If the TIE
bit in SCR is set to the enable state, a TXI interrupt is requested. If TXI is enabled as a
DMA transfer activation source, the next data can be written in TDR automatically. When
the DMAC writes data in TDR, it automatically clears the TDRE bit to 0.
Frame n
Figure 14.12 Retransmission in SCI Transmit Mode
DE
(6)
(7)
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Transfer from TDR to TSR
Retransmitted frame
Rev. 3.00 Mar 21, 2006 page 519 of 814
Section 14 Smart Card Interface
(DE)
(8)
(9)
Ds
Transfer from
TDR to TSR
REJ09B0302-0300
D0 D1 D2 D3 D4
Frame n + 1
Related parts for DF3052BX25V
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
CONN HEADER 20POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 24POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 44POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN RCPT 44POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN PLUG 20POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 60POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN RECEPT 60POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 34POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 30POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
CONN HEADER 40POS 0.4MM SMD GOLD
Manufacturer:
Hirose Electric Co Ltd
Datasheet:
Part Number:
Description:
KIT STARTER FOR M16C/29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/2D
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
R0K33062P STARTER KIT
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/23 E8A
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/25
Manufacturer:
Renesas Electronics America
Datasheet: