DF2148BFA20 Renesas Electronics America, DF2148BFA20 Datasheet - Page 6
![IC H8S MCU FLASH 128K 100-QFP](/photos/12/21/122166/qfp100-g1_pkg_sml.jpg)
DF2148BFA20
Manufacturer Part Number
DF2148BFA20
Description
IC H8S MCU FLASH 128K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Specifications of DF2148BFA20
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
74
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2148BFA20
HD64F2148BFA20
HD64F2148BFA20
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2148BFA20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2148BFA20IV
Manufacturer:
VISHAY
Quantity:
8 001
Company:
Part Number:
DF2148BFA20IV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2148BFA20V
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
DF2148BFA20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition
5. Contents
6. Overview
7. Description of Functional Modules
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev. 3.00 Mar 21, 2006 page iv of liv
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
•
•
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
CPU and System-Control Modules
On-Chip Peripheral Modules
Configuration of This Manual
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