MC68HC711E9MFNE2 Freescale Semiconductor, MC68HC711E9MFNE2 Datasheet - Page 23

• Manufacturer Part Number: MC68HC711E9MFNE2
• Description: IC MCU 8BIT 512BYTES ROM 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC711E9MFNE2

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: OTP
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 52-PLCC
• Processor Series: HC711E
• Core: HC11
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 2 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 8
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.1 Contents
1.2 Introduction
M68HC11E Family — Rev. 3.2
MOTOROLA
Technical Data — M68HC11E Family
1.2
1.3
1.4
This document contains a detailed description of the M68HC11 E series
of 8-bit microcontroller units (MCUs). These MCUs all combine the
M68HC11 central processor unit (CPU) with high-performance, on-chip
peripherals.
With the exception of a few minor differences, the operation of all
E-series MCUs is identical. A fully static design and high-density
complementary metal-oxide semiconductor (HCMOS) fabrication
process allow the E-series devices to operate at frequencies from 3 MHz
to dc with very low power consumption.
The E series is comprised of many devices with various
configurations of:
•
•
•
•
•
Random-access memory (RAM)
Read-only memory (ROM)
Erasable programmable read-only memory (EPROM)
Electrically erasable programmable read-only memory
(EEPROM)
Several low-voltage devices are also available.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
General Description
Section 1. General Description
Technical Data
23