MC68HC11K1CFUE3 Freescale Semiconductor, MC68HC11K1CFUE3 Datasheet - Page 25

• Manufacturer Part Number: MC68HC11K1CFUE3
• Description: MCU 8-BIT 768 RAM 3MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11K1CFUE3

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Type: ROMless
• Eeprom Size: 640 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

1.1 Contents
1.2 Introduction
M68HC11K Family
MOTOROLA
Technical Data — M68HC11K Family
1.2
1.3
1.4
1.5
The M68HC11K Family of high-performance microcontroller units
(MCUs) offers a non-multiplexed expanded bus, high speed and low
power consumption. The fully static design allows operation at
frequencies from dc to 4 MHz.
This manual contains information concerning standard and
custom-ROM (read-only memory) devices. Standard devices include
those replacing the ROM with:
Custom-ROM devices have a ROM array that is programmed at the
factory to customer specifications.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Disabled ROM
Disabled EEPROM (electrically erasable, programmable
read-only memory)
EPROM (erasable, programmable read-only memory)
OTPROM (one-time progammable read-only memory)
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
M68HC11K Family Members . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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General Description
Section 1. General Description
Technical Data
25