MC9S12XEQ384CAL Freescale Semiconductor, MC9S12XEQ384CAL Datasheet - Page 1218
MC9S12XEQ384CAL
Manufacturer Part Number
MC9S12XEQ384CAL
Description
MCU 16BIT 384K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XEQ384CAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
24 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
FREESCAL
Quantity:
256
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XEQ384CAL
Manufacturer:
NXP/恩智浦
Quantity:
20 000
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Appendix A Electrical Characteristics
1218
Conditions are shown in
Num
10
11
12
1
2
3
4
5
6
7
8
9
C
T
T
T
T
T
T
T
T
T
T
T
T
Table A-10
MC9S12XE-Family Reference Manual , Rev. 1.23
Table A-12. Module Run Supply Currents
Each MSCAN
S12XCPU
Each ATD
Overhead
Each SPI
Each SCI
Each IIC
XGATE
at ambient temperature unless otherwise noted
Rating
PWM
ECT
PIT
RTI
Min
—
—
—
—
—
—
—
—
—
—
—
—
12.76
24.20
35.56
1.05
0.22
0.28
0.40
0.55
1.16
0.82
0.61
0.17
Typ
Freescale Semiconductor
Max
—
—
—
—
—
—
—
—
—
—
—
—
Unit
mA
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