MC9S08RD32CDWE Freescale Semiconductor, MC9S08RD32CDWE Datasheet - Page 214

• Manufacturer Part Number: MC9S08RD32CDWE
• Description: IC MCU 32K FLASH 2K RAM 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08RD32CDWE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: S08RD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08RG60E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Electrical Characteristics
A.9.3
Table A-11
214
and
SPI Timing
External clock frequency
External clock period
External clock high time
External clock low time
Input capture pulse width
Figure A-11
TPM1CHn
Function
through
TPM1CHn
TPM1CHn
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Figure A-10. Timer Input Capture Pulse
Figure A-9. Timer External Clock
Figure A-14
Table A-10. TPM Input Timing
t
clkh
Symbol
f
t
describe the timing requirements for the SPI system.
TPMext
TPMext
t
ICPW
t
t
t
t
clkh
clkl
ICPW
ICPW
t
Text
t
clkl
Min
1.5
1.5
1.5
dc
4
f
Max
Bus
—
—
—
—
/4
Freescale Semiconductor
MHz
Unit
t
t
t
t
cyc
cyc
cyc
cyc