STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 42

• Manufacturer Part Number: STM32F103ZET6TR
• Description: MCU 32BIT ARM 512K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZET6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 21 Channel
• On-chip Dac: 12 bit, 2 Channel
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 112
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
5.3
5.3.1
42/123
Table 9.
Operating conditions
General operating conditions
Table 10.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Symbol
V
between V
characteristics on page
Table 6.2: Thermal characteristics on page
f
f
f
PCLK1
PCLK2
V
DDA
HCLK
V
P
T
T
BAT
DD
Symbol
A
A
D
J
T
is lower, higher P
(1)
STG
T
J
DD
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
85 °C for suffix 6 or T
105 °C for suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
and V
DDA
Storage temperature range
Maximum junction temperature
D
Parameter
114).
can be tolerated during power-up and operation.
values are allowed as long as T
DD
A
Table 58: ADC
(3)
and V
can be extended to this range as long as T
Doc ID 14611 Rev 7
A
A
=
=
DDA
Ratings
114).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP144
LQFP100
LQFP64
LFBGA100
LFBGA144
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
STM32F103xC, STM32F103xD, STM32F103xE
DD
J
(2)
does not exceed T
Conditions
(4)
(4)
J
J
max (see
does not exceed T
–65 to +150
Min
–40
–40
–40
–40
–40
–40
2.4
1.8
Value
150
0
0
0
2
2
Table 6.2: Thermal
Max
666
434
444
500
500
105
105
125
105
125
3.6
3.6
3.6
3.6
72
36
72
85
J
max (see
Unit
MHz
Unit
mW
°C
°C
°C
°C
°C
V
V
V