STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 22
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STM32F103ZET6TR
Manufacturer Part Number
STM32F103ZET6TR
Description
MCU 32BIT ARM 512K FLASH 100-LQF
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F103ZET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
11
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 21 Channel
On-chip Dac
12 bit, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Description
2.3.24
2.3.25
2.3.26
2.3.27
22/123
Universal serial bus (USB)
The STM32F103xC, STM32F103xD and STM32F103xE performance line embed a USB
device peripheral compatible with the USB full-speed 12 Mbs. The USB interface
implements a full-speed (12 Mbit/s) function interface. It has software-configurable endpoint
setting and suspend/resume support. The dedicated 48 MHz clock is generated from the
internal main PLL (the clock source must use a HSE crystal oscillator).
GPIOs (general-purpose inputs/outputs)
Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions. All GPIOs are high current-
capable except for analog inputs.
The I/Os alternate function configuration can be locked if needed following a specific
sequence in order to avoid spurious writing to the I/Os registers.
I/Os on APB2 with up to 18 MHz toggling speed
ADC (analog to digital converter)
Three 12-bit analog-to-digital converters are embedded into STM32F103xC, STM32F103xD
and STM32F103xE performance line devices and each ADC shares up to 21 external
channels, performing conversions in single-shot or scan modes. In scan mode, automatic
conversion is performed on a selected group of analog inputs.
Additional logic functions embedded in the ADC interface allow:
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The ADC can be served by the DMA controller.
An analog watchdog feature allows very precise monitoring of the converted voltage of one,
some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
The events generated by the general-purpose timers (TIMx) and the advanced-control
timers (TIM1 and TIM8) can be internally connected to the ADC start trigger and injection
trigger, respectively, to allow the application to synchronize A/D conversion and timers.
DAC (digital-to-analog converter)
The two 12-bit buffered DAC channels can be used to convert two digital signals into two
analog voltage signal outputs. The chosen design structure is composed of integrated
resistor strings and an amplifier in inverting configuration.
Simultaneous sample and hold
Interleaved sample and hold
Single shunt
Doc ID 14611 Rev 7
STM32F103xC, STM32F103xD, STM32F103xE