STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 109
![MCU 32BIT ARM 512K FLASH 100-LQF](/photos/39/71/397107/lqfp-144_sml.jpg)
STM32F103ZET6TR
Manufacturer Part Number
STM32F103ZET6TR
Description
MCU 32BIT ARM 512K FLASH 100-LQF
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F103ZET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
11
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 21 Channel
On-chip Dac
12 bit, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
STM32F103xC, STM32F103xD, STM32F103xE
Figure 61. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 66.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
A
A1
A2
b
e
e1
F
G
D
E
H
L
eee
aaa
Number of balls
(2)
H
Marking area
A1 ball corner
Symbol
eee
Ball
package outline
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Wafer back side
D
0.535
0.205
0.330
0.290
4.446
4.375
Detail A rotated 90 ˚
Min
b
L
Doc ID 14611 Rev 7
0.585
0.230
0.355
0.320
0.500
3.500
0.447
0.483
4.466
4.395
0.250
0.200
0.05
0.10
millimeters
L
E
Typ
Seating plane (see note 2)
aaa
A1
A2
0.635
0.255
0.380
0.350
4.486
4.415
Side view
Max
A
Detail A
64
Notch
A
B
C
D
E
F
G
H
0.0211
0.0081
0.0130
0.0114
0.1750
0.1722
Min
8
7
Package characteristics
6
Ball side
5
inches
e1
0.0230
0.0091
0.0140
0.0126
0.0197
0.1378
0.0176
0.0190
0.1758
0.1730
0.0098
0.0079
0.0020
0.0039
4
Typ
3
e
(1)
2
G
1
0.0250
0.0100
0.0150
0.0138
0.1766
0.1738
A1 ball corner
Max
109/123
e
F
CR_ME
e1