STM32F102C8T6TR STMicroelectronics, STM32F102C8T6TR Datasheet - Page 68

• Manufacturer Part Number: STM32F102C8T6TR
• Description: MCU 32BIT ARM 64K FLASH 48-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F102C8T6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: STM32F102x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 10 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Revision history
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68/69
Revision history
Table 53.
23-Sep-2008
22-Sep-2009
23-Apr-2009
Date
Document revision history
Revision
1
2
3
Initial release.
I/O information clarified
density USB access line block diagram
modified.
In
PB14, PB15, PB3/TRACESWO moved from Default column to Remap
column.
P
conditions.
Note modified in
code with data processing running from Flash
current consumption in Sleep mode, code running from Flash or
Figure
Figure 27: ADC accuracy characteristics
Figure 29: Power supply and reference decoupling
Table 19: High-speed external user clock characteristics
Low-speed external user clock characteristics
ACC
Small text changes.
Note 5
V
voltage. Typical I
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
oscillator characteristics
Low-power mode wakeup
Note 1
crystal.
Figure 21: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
Table 40: SPI characteristics
C
R
Small text changes.
HSE_ext
D
RERINT
L1
ADC
AIN
Table 4: Medium-density STM32F102xx pin
value added for LQFP64 package in
and C
HSI
max values modified in
and R
Doc ID 15056 Rev 3
13,
updated in
modified below
kHz), notes modified and moved below the tables.
max values modified in
min modified in
and T
L2
Figure 14
AIN
replaced by C in
Coeff
Table 26: PLL
and
Section 5.3.10: EMC characteristics on page
parameters modified in
DD_VBAT
Table 12: Maximum current consumption in Run mode,
Table 4: Medium-density STM32F102xx pin
Table 22: LSE oscillator characteristics (fLSE =
added to
and
added.
Figure 18: Typical application with an 8 MHz
on page
Table 19: High-speed external user clock
modified. Conditions removed from
value added in
Figure 15
timings.
Table 45: RAIN max for fADC = 12
Table 11: Embedded internal reference
modified.
characteristics.
Table 21: HSE 4-16 MHz oscillator
Changes
Table 23: HSI oscillator
1.
Figure 1: STM32F102xx medium-
show typical curves.
STM32F102x8, STM32F102xB
Table 44: ADC
and
Table 8: General operating
Table 15: Typical and maximum
modified.
modes.
Figure 5: Memory map
modified.
definitions: PB4, PB13,
and
modified.
modified.
Table 14: Maximum
Figure 12: Typical
characteristics.
characteristics.
and
Table 23: HSI
Table 25:
Table 20:
44.
definitions.
MHz.
RAM.