STM32F102C6T6ATR STMicroelectronics, STM32F102C6T6ATR Datasheet - Page 68
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STM32F102C6T6ATR
Manufacturer Part Number
STM32F102C6T6ATR
Description
MCU 32BIT ARM 32K FLASH 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F102C6T6A.pdf
(69 pages)
Specifications of STM32F102C6T6ATR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
48MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F102x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
6 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
37
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F102C6T6ATR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Revision history
8
68/69
Revision history
Table 53.
23-Sep-2008
24-Sep-2009
09-Apr-2009
Date
Document revision history
Revision
1
2
3
Initial release.
I/O information clarified
USB access line block diagram
In
PB15, PB3/TRACESWO moved from Default column to Remap column,
Note 4
P
conditions.
Note modified in
code with data processing running from Flash
current consumption in Sleep mode, code running from Flash or
Figure
Figure 27: ADC accuracy characteristics
Figure 29: Power supply and reference decoupling
changes.
Table 19: High-speed external user clock characteristics
Low-speed external user clock characteristics
ACC
Note 5
pin
maximum current consumptions in Stop and Standby
Typical current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
oscillator characteristics
Low-power mode wakeup
Note 1
crystal.
Figure 21: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
C
R
HSE_ext
D
L1
ADC
AIN
Table 4: low-density STM32F102xx pin
value added for LQFP64 package in
definitions. Typical I
and C
HSI
max values modified in
and R
Doc ID 15057 Rev 3
13,
added.
updated and
modified below
kHz), notes modified and moved below the tables.
max values modified in
min modified in
L2
Figure 14
AIN
replaced by C in
Table 26: PLL
and
Section 5.3.10: EMC characteristics on page
parameters modified in
Table 12: Maximum current consumption in Run mode,
Table 22: LSE oscillator characteristics (fLSE =
Note 4
and
added.
Figure 18: Typical application with an 8 MHz
DD_VBAT
on page
Table 19: High-speed external user clock
modified. Conditions removed from
Figure 15
timings.
added in
Table 45: RAIN max for fADC = 12
characteristics.
Table 21: HSE 4-16 MHz oscillator
Changes
and
Table 23: HSI oscillator
value added in
1.
Figure 1: STM32F102xx low-density
show typical curves.
Figure 5: Memory map
Table 4: low-density STM32F102xx
STM32F102x4, STM32F102x6
Table 44: ADC
Table 8: General operating
modified.
definitions: PB4, PB13, PB14,
modified.
and
Table 15: Typical and
modified.
modified. Small text
Table 14: Maximum
modes.
characteristics.
characteristics.
and
Table 23: HSI
modified.
Table 25:
Table 20:
44.
Figure 12:
MHz.
RAM.