STM32F102C6T6ATR STMicroelectronics, STM32F102C6T6ATR Datasheet - Page 38
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STM32F102C6T6ATR
Manufacturer Part Number
STM32F102C6T6ATR
Description
MCU 32BIT ARM 32K FLASH 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F102C6T6A.pdf
(69 pages)
Specifications of STM32F102C6T6ATR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
48MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F102x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
6 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
37
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F102C6T6ATR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
5.3.6
Table 19.
1. Guaranteed by design, not tested in production.
Table 20.
1. Guaranteed by design, not tested in production.
38/69
DuCy
DuCy
Symbol
C
f
Symbol
t
t
C
V
f
LSE_ext
V
t
t
t
t
w(LSE)
w(LSE)
V
HSE_ext
V
r(LSE)
t
t
f(LSE)
in(LSE)
w(HSE)
w(HSE)
r(HSE)
f(HSE)
in(HSE)
LSEH
LSEL
HSEH
HSEL
I
L
I
(LSE)
L
(HSE)
External clock source characteristics
High-speed external user clock generated from an external source
The characteristics given in
external clock source, and under ambient temperature and supply voltage conditions
summarized in
High-speed external user clock characteristics
Low-speed external user clock generated from an external source
The characteristics given in
external clock source, and under ambient temperature and supply voltage conditions
summarized in
Low-speed external user clock characteristics
User external clock source frequency
OSC32_IN input pin high level voltage
OSC32_IN input pin low level voltage
OSC32_IN high or low time
OSC32_IN rise or fall time
OSC32_IN input capacitance
Duty cycle
OSC32_IN Input leakage current
User external clock source frequency
OSC_IN input pin high level voltage
OSC_IN input pin low level voltage
OSC_IN high or low time
OSC_IN rise or fall time
OSC_IN input capacitance
Duty cycle
OSC_IN Input leakage current
Parameter
Parameter
Table
Table
8.
8.
(1)
(1)
(1)
(1)
(1)
(1)
Table 19
Table 20
Doc ID 15057 Rev 3
(1)
(1)
result from tests performed using an high-speed
result from tests performed using an low-speed
V
SS
V
Conditions
SS
Conditions
V
V
IN
IN
V
V
DD
DD
0.7V
Min
V
450
0.7V
30
SS
STM32F102x4, STM32F102x6
Min
V
16
45
DD
1
SS
DD
32.768
Typ
Typ
5
8
5
0.3V
0.3V
1000
Max
V
Max
V
50
70
±1
25
20
55
±1
DD
DD
DD
DD
Unit
MHz
kHz
Unit
µA
pF
ns
µA
%
ns
pF
V
%
V