ST7FLIT19BF1M3 STMicroelectronics, ST7FLIT19BF1M3 Datasheet - Page 148
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ST7FLIT19BF1M3
Manufacturer Part Number
ST7FLIT19BF1M3
Description
IC MCU 8BIT 4K FLASH 20-SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FLIT15BY1M6.pdf
(159 pages)
Specifications of ST7FLIT19BF1M3
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
ST7FLIT1x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7FLIT1B-D/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 7 Channel
For Use With
497-6232 - BOARD EVAL ST7LITE1B,STP5NK60Z497-5049 - KIT STARTER RAISONANCE ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FLIT19BF1M3
Manufacturer:
ST
Quantity:
20 000
ST7LITE1xB
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 25. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
148/159
SDIP & PDIP
QFN
TQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
transition program is available on
packages are qualified according
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
Yes
TM
TQFP, SDIP, SO and QFN20
Pb-free solder paste
Yes *
Yes *
Yes *