P80C557E4EFB/01,55 NXP Semiconductors, P80C557E4EFB/01,55 Datasheet - Page 66

IC 80C51 MCU 1024 ROMLESS 80QFP

P80C557E4EFB/01,55

Manufacturer Part Number
P80C557E4EFB/01,55
Description
IC 80C51 MCU 1024 ROMLESS 80QFP
Manufacturer
NXP Semiconductors
Series
80Cr
Datasheet

Specifications of P80C557E4EFB/01,55

Core Processor
8051
Core Size
8-Bit
Speed
16MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
40
Program Memory Type
ROMless
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
P80C5x
Core
80C51
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
40
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details
Other names
935263156557
P80C557E4FB
P80C557E4FB

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P80C557E4EFB/01,55
Manufacturer:
IR
Quantity:
20
Part Number:
P80C557E4EFB/01,55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
AC ELECTRICAL CHARACTERISTICS (Continued)
All values referred to V
NOTES:
1. A device must internally provide a hold time of at least 300 ns from the SDA signal (referred to the V
2. The maximum t
3. A fast-mode I
4. C
Table 46. External clock drive XTAL1 (refer to Figure 57)
NOTE:
1. t
1999 Mar 02
SYMBOL
I
f
t
t
t
t
t
t
t
t
t
t
C
t
SYMBOL
t
t
t
t
t
t
2
SCL
BUF
HD; STA
LOW
HIGH
SU; STA
HD; DAT
SU; DAT
FD
FD
SU
SP
CLK
CLKH
CLKL
CLKR
CLKF
CYC
Single-chip 8-bit microcontroller
C Interface timing (refer to Figure 63)
b
bridge the undefined region of the falling edge of SCL.
will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period
of the SCL signal, it must output the next data bit to the SDA line t
I
, t
, t
;
2
CYC
STO
C-bus specification) before the SCL line is released.
b
FC
FC
1)
= total capacitance of one bus line in pF.
= 12 f
CLK
XTAL1 Period
XTAL1 HIGH time
XTAL1 LOW time
XTAL1 rise time
XTAL1 fall time
Controller cycle time
SCL clock frequency
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period, the
first clock pulse is generated
LOW period of the SCL clock
High period of the SCL clock
Set-up time for a repeated START condition
Data hold time:
for CBUS competible masters (see Section 9, Notes 1, 3)
for I
Data set-up time
Rise time of both SDA and SCL signals
Fall time of both SDA and SCL signals
Set-up time for STOP condition
Capacitive load for each bus line
Pulse width of spikes which must be suppressed by the input
filter
2
C-bus device can be used in a standard-mode I
HD,DAT
2
C-bus devices
IH
and V
has only to be met if the device does not stretch the LOW period (t
IL max
levels.
PARAMETER
PARAMETER
2
C-bus system, but the requirement t
Rmax
66
P83C557E4/P80C557E4/P89C557E4
+ t
SU,DAT
= 1000 + 250 = 1250 ns (according to the standard-mode
Standard-mode
MIN
250
4.7
4.0
4.7
4.0
4.7
5.0
4.0
0
0
1
I
2
C-bus
LOW
0.75
MIN
63
20
20
f
VARIABLE CLOCK
CLK
MAX
1000
) of the SCL signal.
100
300
400
= 3.5 to 16 MHz
SU,DAT
IH min
0.1C
0.1C
of the SCL signal) in order to
100
> 250 ns must then be met. This
20 +
20 +
MIN
1.3
0.6
1.3
0.6
0.6
0.6
0
0
0
1
Fast-mode
MAX
3
b
b
286
3.4
20
20
I
4
4
2
C-bus
MAX
0.9
400
300
300
400
Product specification
50
2
UNIT
ns
ns
ns
ns
ns
s
UNIT
kHz
ns
ns
ns
pF
ns
s
s
s
s
s
s
s

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