LPC3143FET180,551 NXP Semiconductors, LPC3143FET180,551 Datasheet - Page 47

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LPC3143FET180,551

Manufacturer Part Number
LPC3143FET180,551
Description
IC ARM9 MCU USB OTG 180TFBGA
Manufacturer
NXP Semiconductors
Series
LPC3000r
Datasheet

Specifications of LPC3143FET180,551

Package / Case
180-TFBGA
Voltage - Supply (vcc/vdd)
1.1 V ~ 1.3 V
Operating Temperature
-40°C ~ 85°C
Speed
270MHz
Number Of I /o
20
Core Processor
ARM9
Program Memory Type
External Program Memory
Ram Size
192K x 8
Data Converters
A/D 4x10b
Oscillator Type
External
Peripherals
DMA, I²S, LCD, PWM, WDT
Connectivity
EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
Core Size
32-Bit
Processor Series
LPC31
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
192 KB
Interface Type
I2C, I2S, SPI, JTAG, UART, USB
Maximum Clock Frequency
270 MHz
Number Of Timers
5
Operating Supply Voltage
1.2 V, 1.8 V, 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3143FET180,551
Manufacturer:
AD
Quantity:
2 872
Part Number:
LPC3143FET180,551
Manufacturer:
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Quantity:
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NXP Semiconductors
Table 14.
[1]
[2]
[3]
[4]
[5]
[6]
LPC3141_3143
Preliminary data sheet
Symbol
Internal SRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; without
dynamic clock scaling; MMU off
I
P
Internal SRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; with
dynamic clock scaling; MMU off
I
P
DD
DD
12 Mhz oscillator running; PLLs off; SYS_BASE and AHB_APB0_BASE Base domain clocks are enabled, driven by 12 Mhz oscillator;
all peripherals off; SUP4 buffers set to input w/PD; SUP8 and SUP3 buffers set to input w/repeater. Shutting off the 12 Mhz osc will
reduce power to 1.4 mW (requires a RSTIN_N to run again).
Running Linux with 100% load; all peripherals on; instruction and data caches on; MMU on.
Dynamic clock scaling active; hardware will automatically switch the SYSBASE clocks to a slow clock (180 / 64 = 2.81 MHz) during
times of bus inactivity. ARM926 and NAND flash clocks are not scaled for this test.
Running Linux idle at prompt; all peripherals on; instruction and data caches on; MMU on.
Running Dhrystone test (600 k/sec); UART and timers enabled; instruction and data caches on; MMU on.
Running Dhrystone test (121.83 k/sec); UART and timers enabled; instruction and data caches off; MMU off.
Parameter
Supply current
Power dissipation
Supply current
Power dissipation
Power consumption
Conditions
core; VDDI = 1.2 V
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
VDDE_IOA = 1.8 V
VDDE_IOB = 1.8 V
VDDE_IOC = 3.3 V
ADC10B_VDDA33 = 3.3 V
USB_VDDA33 = 3.3 V
USB_VDDA_DRV = 3.3 V
Total for supply domains SUP1, SUP3, SUP4,
SUP8
core; VDDI = 1.2 V
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
VDDE_IOA = 1.8 V
VDDE_IOB = 1.8 V
VDDE_IOC = 3.3 V
ADC10B_VDDA33 = 3.3 V
USB_VDDA33 = 3.3 V
USB_VDDA_DRV = 3.3 V
Total for supply domains SUP1, SUP3, SUP4,
SUP8
…continued
[6]
[3][6]
All information provided in this document is subject to legal disclaimers.
Rev. 0.16 — 27 May 2010
LPC3141/3143
Min
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Typ
37.95
2.1
2.25
0
0.79
0.0002
0.89
1.75
63.44
17.8
2.1
2.25
0
0.79
0.0002
0.89
1.75
39.26
© NXP B.V. 2010. All rights reserved.
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