LPC2368FET100,518 NXP Semiconductors, LPC2368FET100,518 Datasheet - Page 57

• Manufacturer Part Number: LPC2368FET100,518
• Description: IC ARM7 MCU FLASH 512K 100TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2368FET100,518

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100, MCB2360, MCB2360U, MCB2360UME
• Development Tools By Supplier: OM10095, OM11042
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4917 - DEVELOPMENT BOARD FOR LPC2368622-1022 - BOARD SCKT ADAPTER FOR TFBGA100MCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935285102518; LPC2368FET100-T; LPC2368FET100-T

NXP Semiconductors
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
LPC2364_65_66_67_68_6
Product data sheet
http://www.nxp.com
Rev. 06 — 1 February 2010
[e-mail]
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
© NXP B.V. 2010. All rights reserved.
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