PIC16C63-04/SO Microchip Technology, PIC16C63-04/SO Datasheet - Page 216

• Manufacturer Part Number: PIC16C63-04/SO
• Description: IC MCU OTP 4KX14 PWM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C63-04/SO

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16C
• No. Of I/o's: 22
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• No. Of Pwm: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16C6X
20.1
DS30234D-page 216
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
DC CHARACTERISTICS
D001
D001A
D002*
D003
D004*
D010
D013
D020
D021
D021A
Note 1: This is the limit to which V
Param
No.
*
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DC Characteristics:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
ization and is for design guidance only. This is not tested.
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Supply Current (Note 2, 5) I
Power-down Current
(Note 3, 5)
DD
DD
start voltage to
rise rate to ensure
Characteristic
DD
; WDT enabled/disabled as specified.
DD
DD
PIC16C65-04 (Commercial, Industrial)
PIC16C65-10 (Commercial, Industrial)
PIC16C65-20 (Commercial, Industrial)
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
V
V
S
I
can be lowered without losing RAM data.
DD
PD
Sym
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
DD
DR
POR
VDD
0.05
Min
4.0
4.5
-
-
-
-
-
-
-
Typ† Max Units
13.5
10.5
V
1.5
2.7
1.5
1.5
-
-
SS
-
800
800
800
6.0
5.5
30
5
-
-
-
0˚C
-40˚C
V/ms See section on Power-on Reset for details
mA
mA
V
V
V
V
A
A
A
XT, RC osc configuration
F
V
T
T
XT, RC and LP osc configuration
HS osc configuration
See section on Power-on Reset for details
HS osc configuration
F
V
V
A
A
OSC
OSC
DD
DD
DD
= 4.0V, WDT enabled,-40 C to +85 C
= 4.0V, WDT disabled,-0 C to +70 C
= 4.0V, WDT disabled,-40 C to +85 C
+85˚C for industrial and
+70˚C for commercial
= 4 MHz, V
= 20 MHz, V
DD
1997 Microchip Technology Inc.
Conditions
,
DD
DD
= 5.5V (Note 4)
= 5.5V
DD
and V
SS
.