DSPIC30F2010-20E/SP Microchip Technology, DSPIC30F2010-20E/SP Datasheet - Page 14

• Manufacturer Part Number: DSPIC30F2010-20E/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010-20E/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F2010
2.3
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and 16/
16-bit signed and unsigned integer divide operations, in
the form of single instruction iterative divides. The fol-
lowing instructions and data sizes are supported:
1.
2.
3.
4.
5.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70118G-page 12
DIVF
DIV.sd
DIV.ud
DIV.sw (or DIV.s)
DIV.uw (or DIV.u)
DIVF – 16/16 signed fractional divide
DIV.sd – 32/16 signed divide
DIV.ud – 32/16 unsigned divide
DIV.sw – 16/16 signed divide
DIV.uw – 16/16 unsigned divide
Divide Support
Instruction
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn
Signed divide: (Wm + 1:Wm)/Wn
Unsigned divide: (Wm + 1:Wm)/Wn
Signed divide: Wm/Wn
Unsigned divide: Wm/Wn
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a series
of discrete divide instructions) will not function correctly
because the instruction flow depends on RCOUNT.
The divide instruction does not automatically set up the
RCOUNT value, and it must, therefore, be explicitly
and correctly specified in the REPEAT instruction, as
shown in Table 2-1 (REPEAT will execute the target
instruction {operand value + 1} times). The REPEAT
loop count must be set up for 18 iterations of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
Note:
W0; Rem
W0; Rem
Function
The Divide flow is interruptible. However,
the user needs to save the context as
appropriate.
W0; Rem
W0; Rem
W0; Rem
W1
W1
© 2006 Microchip Technology Inc.
W1
W1
W1