PIC16F684T-E/ST Microchip Technology, PIC16F684T-E/ST Datasheet - Page 179

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PIC16F684T-E/ST

Manufacturer Part Number
PIC16F684T-E/ST
Description
IC PIC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F684T-E/ST

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
14-TSSOP
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F684T-E/ST
Quantity:
900
© 2007 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
PAD
1
2
MIN
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.65 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.65
2.65
0.30
0.40
16
Microchip Technology Drawing C04-127B
D2
PIC16F684
MAX
1.00
0.05
0.50
2.80
2.80
0.35
DS41202F-page 177
L
K
b
e

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