PIC16F684T-E/ST Microchip Technology, PIC16F684T-E/ST Datasheet - Page 131

• Manufacturer Part Number: PIC16F684T-E/ST
• Description: IC PIC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F684T-E/ST

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP
• For Use With: XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Connectivity: -

15.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by PORTA and PORTC (combined) ........................................................................... 90 mA
Maximum current sourced PORTA and PORTC (combined) ........................................................................... 90 mA
Note 1:
© 2007 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
SS
I
(Vo < 0 or Vo >V
< 0 or V
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
SS
I
> V
(†)
................................................................................................... -0.3V to +6.5V
DD
SS
)...............................................................................................................± 20 mA
DD
........................................................................... -0.3V to (V
).........................................................................................................± 20 mA
DIS
= V
DD
x {I
DD
– ∑ I
OH
} + ∑ {(V
DD
PIC16F684
– V
OH
) x I
DS41202F-page 129
OH
} + ∑(V
DD
+ 0.3V)
O
l x I
OL
).