PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 155

• Manufacturer Part Number: PIC12F615-I/MS
• Description: IC PIC MCU FLASH 1KX14 8MSOP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F615-I/MS

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Number Of I /o: 5
• Program Memory Type: FLASH
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
© 2006 Microchip Technology Inc.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
§
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
PIC12F609/615/12HV609/615
MIN
Preliminary
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
INCHES*
NOM
8
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
4.80
0.25
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
NOM
8
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
4
DS41302A-page 153
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8