PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 154
![IC PIC MCU FLASH 1KX14 8MSOP](/photos/6/59/65932/mfg_150_c04-111_ms_8-msop_sml.jpg)
PIC12F615-I/MS
Manufacturer Part Number
PIC12F615-I/MS
Description
IC PIC MCU FLASH 1KX14 8MSOP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-I/MS
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F615-I/MS
Manufacturer:
RICHTEK
Quantity:
5 400
Part Number:
PIC12F615-I/MS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F609/615/12HV609/615
17.2
The following sections give the technical details of the packages.
8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
DS41302A-page 152
Note:
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
§
Units
2
1
eB
A2
A1
E1
B1
D
n
p
A
E
L
B
c
c
D
MIN
Preliminary
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
8
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
8
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
p
A2
MAX
10.92
L
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
4.32
15
15