PIC12F510-E/SN Microchip Technology, PIC12F510-E/SN Datasheet - Page 123
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PIC12F510-E/SN
Manufacturer Part Number
PIC12F510-E/SN
Description
IC PIC MCU FLASH 1KX14 8SOIC
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F510-ISN.pdf
(124 pages)
2.PIC12F510-ISN.pdf
(8 pages)
3.PIC12F510-ISN.pdf
(20 pages)
Specifications of PIC12F510-E/SN
Core Size
8-Bit
Program Memory Size
1.5KB (1K x 12)
Core Processor
PIC
Speed
8MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
38 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOIC (3.9mm Width)
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
38Byte
Cpu Speed
8MHz
No. Of Timers
1
Digital Ic Case Style
SOIC
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
38 B
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
5
Number Of Timers
1
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162070 - HEADER INTRFC MPLAB ICD2 8/14P
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F506
PIC12F510
PIC16F506T
PIC12F510T
I
E
MC
MS
P
SL
SN
ST
QTP, SQTP Code or Special Requirements
(blank otherwise)
Range
V
DD
X
range 2.0V to 5.5V
= -40°C to
= -40°C to +125°C
=
=
=
=
=
=
(1)
(2)
8L DFN 2x3 (DUAL Flatpack No-Leads)
Micro-Small Outline Package (MSOP)
Plastic (PDIP)
14L Small Outline, 3.90 mm (SOIC)
8L Small Outline, 3.90 mm Narrow (SOIC)
Thin Shrink Small Outline (TSSOP)
Package
/XX
+85°C
(4)
(Industrial)
(Extended)
Pattern
XXX
(4)
(4)
(3, 4)
(3, 4)
(4)
PIC12F510/16F506
Examples:
a)
b)
c)
Note 1:
PIC16F506-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC16F506-I/SN = Industrial Temp., SOIC
package
PIC16F506T-E/P = Extended Temp., PDIP
package, Tape and Reel
2:
3:
4:
T
T
PIC12F510 only.
Pb-free.
= in tape and reel SOIC and TSSOP
= in tape and reel SOIC and MSOP
packages only
packages only.
.
DS41268D-page 121