MC9S12HZ256CAL Freescale Semiconductor, MC9S12HZ256CAL Datasheet - Page 627
MC9S12HZ256CAL
Manufacturer Part Number
MC9S12HZ256CAL
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12HZ128CAL.pdf
(692 pages)
Specifications of MC9S12HZ256CAL
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI
Peripherals
LCD, Motor control PWM, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12H
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
85
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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A.1.7
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
Freescale Semiconductor
1
2
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Crystal oscillator (Colpitts)
Crystal oscillator (Pierce)
Bus Frequency
Operating Junction Temperature Range
Operating Ambient Temperature Range
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external source.
Please refer to
between ambient temperature T
4
5
C Latch-up Current at T
C Latch-up Current at T
Operating Conditions
positive
negative
positive
negative
Please refer to the temperature rating of the device (C, V, M) with regards to
the ambient temperature T
dissipation calculations refer to
Thermal
Section A.1.8, “Power Dissipation and Thermal
2
Rating
Characteristics.”
Table A-3. ESD and Latch-Up Protection Characteristics
1
A
A
A
and device junction temperature T
= 125 C
= 27 C
MC9S12HZ256 Data Sheet, Rev. 2.05
Table A-4. Operating Conditions
2
A
M parts
M parts
C parts
C parts
V parts
V parts
and the junction temperature T
Section A.1.8, “Power Dissipation and
NOTE
Symbol
V
V
DDPLL
V
VDDX
VSSX
f
f
f
osc
osc
bus
T
T
DD5
DD
A
J
Characteristics,” for more details about the relation
J
.
I
I
LAT
LAT
2.35
2.35
–0.1
–0.1
Min
–40
–40
4.5
0.5
0.5
0.5
+100
–100
+200
–200
J
. For power
Appendix A Electrical Characteristics
Typ
2.5
2.5
27
5
0
0
–
–
–
–
–
–
Max
2.75
2.75
100
120
140
105
125
5.5
0.1
0.1
16
40
25
85
mA
mA
MHz
MHz
MHz
Unit
V
V
V
V
V
C
C
627
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