DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 335

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
4.3
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits
wide, depending on the particular on-chip register being accessed. Figure 4.3 shows the access
timing for the on-chip supporting modules. Figure 4.4 shows the pin states.
Internal address bus
Read
access
Write
access
On-Chip Supporting Module Access Timing
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Figure 4.3 On-Chip Supporting Module Access Timing
T1
Rev. 4.00 Feb 24, 2006 page 319 of 322
Bus cycle
Address
Write data
Read data
T2
Section 4 Basic Timing
REJ09B0139-0400

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